TitleProduct

Embedded Mutil-Chip Package - Emcp (S1A-6001E)

  • Price:

    Negotiable

  • minimum:

  • Total supply:

  • Delivery term:

    The date of payment from buyers deliver within days

  • seat:

    Shanghai

  • Validity to:

    Long-term effective

  • Last update:

    2017-12-19 09:01

  • Browse the number:

    131

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Company Profile

Supertechina (Shanghai) Electronic Co., Ltd.

By certification [File Integrity]

Contact:Mr. Michael Wong(Mr.)  

Email:

Telephone:

Phone:

Area:Shanghai

Address:Shanghai

Website: http://supertechina.zx-rubber.com/

Product Details

EMCP
The eMCP refers to embedded mutil-chip package which is smart phone memory standards with package of eMMC and MCP together. Comparing with traditional MCP, eMCP can reduce the burden on the main chip operation, and manage larger capacity flash memory body because eMCP adopts built-in nand flash controller chip.

Specifications:
Capacity: 4GB+4Gb/4GB+8Gb/8GB+8Gb/16GB+16Gb
EMMC Interface: EMMC v4.51
DRAM Interface: LPDDR2/LPDDR3
Dimension/Package: 11.5mm x 13mm x 1.1mm, 153-ball FBGA
11.5mm x 13mm x 1.1mm, 162-ball FBGA
Core values: A reliable, stable storage space, reducing the area of PCBA
Application: Smart phone, MID
Bad-Block Management: Dynamic Bad-Block Management

Technique parameters:
Storage temperature: -45° C to 85° C,
Operating temperature: -25° C to 85° C
Voltage: 1.2 V

Certificate: CE, FCC, ROHS
Quality warranty term: 5 years
Payment term: 30% deposit and balance before shipment or irrevocable LC at sight
Time of delivery: 5-15 days upon confirming the sample
Port of delivery: Shanghai, H.K., Shenzhen